Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13220064
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Filing Dt:
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08/29/2011
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Publication #:
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Pub Dt:
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02/28/2013
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Inventor:
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Tim Hsiao
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Title:
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METHOD FOR THE FABRICATION OF BONDING SOLDER LAYERS ON METAL BUMPS WITH IMPROVED COPLANARITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 69, TECHNOLOGY 7TH RD., HWAYA TECHNOLOGY PARK |
| KUEI SHAN HSIANG, TAO YUAN SHIEN, TAIWAN |
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| MUNCY, GEISSLER, OLDS & LOWE, PLLC |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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