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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8963340
Issue Dt:
02/24/2015
Application #:
13231594
Filing Dt:
09/13/2011
Publication #:
20130062757
Pub Dt:
03/14/2013
Inventors:
Claudius Feger, Michael A. Gaynes, Jae-Woong Nah, Da-Yuan Shih
Title:
No Flow Underfill or Wafer Level Underfill and Solder Columns
Assignment: 1
Reel/Frame:
026897/0828Recorded: 09/13/2011Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FEGER, CLAUDIUS
Exec Dt:
09/12/2011
GAYNES, MICHAEL A.
Exec Dt:
08/23/2011
NAH, JAE-WOONG
Exec Dt:
08/22/2011
SHIH, DA_YUAN
Exec Dt:
08/30/2011
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
THE LAW OFFICES OF ROBERT J. EICHELBURG
HODAFEL BUILDING, SUITE 200
196 ACTON ROAD
ANNAPOLIS, MD 21403
Assignment: 2
Reel/Frame:
047777/0238Recorded: 12/11/2018Pages: 8
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA OF THE FOURTH INVENTOR PREVIOUSLY RECORDED ON REEL 026897 FRAME 0828. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
FEGER, CLAUDIUS
Exec Dt:
09/12/2011
GAYNES, MICHAEL A.
Exec Dt:
08/23/2011
NAH, JAE-WOONG
Exec Dt:
08/22/2011
SHIH, DA-YUAN
Exec Dt:
08/30/2011
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION
1101 KITCHAWAN ROAD, ROUTE 134, P.O. BOX 218
YORKTOWN, NY 10598

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