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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/11/2014
Application #:
13231812
Filing Dt:
09/13/2011
Publication #:
Pub Dt:
03/14/2013
Inventors:
Bi-Ling Lin, Jian-Hong Lin, Ming-Hong Hsieh, Lee-Der Chen, Jiaw-Ren Shih et al
Title:
Semiconductor Device Components and Methods
Assignment: 1
Reel/Frame:
026898/0496Recorded: 09/13/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/07/2011
Exec Dt:
09/07/2011
Exec Dt:
09/13/2011
Exec Dt:
09/07/2011
Exec Dt:
09/07/2011
Exec Dt:
09/09/2011
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD
SUITE 1000
DALLAS, TX 75252

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