Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13559087
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Filing Dt:
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07/26/2012
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Publication #:
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Pub Dt:
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03/21/2013
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Inventors:
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An-Hong LIU, Hung-Hsin Liu, Jar-Dar Yang, Chi-Chia Huang, Yi-Chang Lee, Hsiang-Ming Huang
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Title:
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FLIP-CHIP PACKAGE STRUCTURE AND FORMING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.1, R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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MUNCY, GEISSLER, OLDS & LOWE, PLLC |
4000 LEGATO ROAD |
SUITE 310 |
FAIRFAX, VA 22033 |
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