Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13270134
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Filing Dt:
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10/10/2011
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Publication #:
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Pub Dt:
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04/11/2013
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Inventors:
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Kok Leong YEO, Chen Seong CHUA, Lee Han Meng @ Eugene LEE, Kooi Choon OOI
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Title:
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DESIGN FOR EXPOSED DIE PACKAGE THAT HELPS PROTECT THE EXPOSED DIE FROM DAMAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12500 TI BOULEVARD M/S 3999 |
| DALLAS, TEXAS 75243 |
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| BEYER LAW GROUP LLP |
| P.O. BOX 1687 |
| CUPERTINO, CA 95015-1687 |
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