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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/24/2014
Application #:
13806907
Filing Dt:
12/26/2012
Publication #:
Pub Dt:
05/02/2013
Inventors:
Hideyuki Abe, Kazuaki Mawatari
Title:
Bonding Structure Manufacturing Method, Heating And Melting Treatment Method, And System Therefor
Assignment: 1
Reel/Frame:
029527/0078Recorded: 12/26/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/18/2012
Exec Dt:
12/17/2012
Assignee:
60, KAGUMACHI, BESSHOCHO, HIMEJI-SHI
HYOGO 671-0225, JAPAN
Correspondent:
PORZIO, BROMBERG & NEWMAN, P.C.
29 THANET ROAD, SUITE 201
PRINCETON, NJ 08540

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