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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/11/2015
Application #:
13657007
Filing Dt:
10/22/2012
Publication #:
Pub Dt:
05/02/2013
Inventors:
Volker Blaschke, Todd Thibeault, David Howard, Chris Cureton, Paul Hurwitz, Arjun Kar-Roy et al
Title:
Method for forming deep silicon via for grounding of circuits and devices, emitter ballasting and isolation
Assignment: 1
Reel/Frame:
029166/0504Recorded: 10/22/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/13/2010
Exec Dt:
05/14/2010
Exec Dt:
05/13/2010
Exec Dt:
05/17/2010
Exec Dt:
05/13/2010
Exec Dt:
05/14/2010
Exec Dt:
05/13/2010
Assignee:
4321 JAMBOREE ROAD
NEWPORT BEACH, CALIFORNIA 92660
Correspondent:
MICHAEL FARJAMI
26522 LA ALAMEDA AVE, SUITE 360
MISSION VIEJO, CA 92691

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