Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2015
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Application #:
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13660263
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Filing Dt:
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10/25/2012
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Publication #:
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Pub Dt:
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05/09/2013
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Inventor:
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Jai Chun Lee
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Title:
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Sputtering Method Using Sputtering Device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB |
| ICHEON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 467-866 |
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| DORITY & MANNING, P.A. AND TICONA LLC |
| POST OFFICE BOX 1449 |
| GREENVILLE, SC 29602 |
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