Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13326478
|
Filing Dt:
|
12/15/2011
|
|
Publication #:
|
|
Pub Dt:
|
05/09/2013
| | | | |
|
Inventors:
|
CHUNG-ER HUANG, YUEH-CHENG LEE
|
|
Title:
|
MODULE IC PACKAGE STRUCTURE HAVING A METAL SHIELDING FUNCTION FOR PREVENTING ELECTRICAL MALFUNCTION INDUCED BY SHORT-CIRCUIT
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8F, NO. 94 BAOZHONG RD., XINDIAN DIST. |
| NEW TAIPEI CITY 231, TAIWAN R.O.C. |
|
|
|
|
| MORTON J. ROSENBERG, ESQ. |
| ROSENBERG KLEIN & LEE |
| 3458 ELLICOTTCENTER DRIVE, SUITE 101 |
| ELLICOTT CITY, MARYLAND 21043 |
|
|
Search Results as of:
06/23/2024 05:20 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
