Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/2016
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Application #:
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13289719
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Filing Dt:
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11/04/2011
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Publication #:
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Pub Dt:
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05/09/2013
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Inventors:
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Meng-Tse Chen, Hsiu-Jen Lin, Chun-Cheng Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu
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Title:
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Apparatus and Methods for Molded Underfills in Flip Chip Packaging
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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