Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13735391
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Filing Dt:
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01/07/2013
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Publication #:
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Pub Dt:
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05/16/2013
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Inventors:
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Won-Hwa LEE, Seok-Chan LEE
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Title:
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Stacked Package And Method Of Manufacturing The Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI |
| GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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