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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13299477
Filing Dt:
11/18/2011
Publication #:
Pub Dt:
05/23/2013
Inventors:
HIROMITSU BABA, TAKESHI KATO, HIROYUKI MINAMI, MASANORI ABE, YUSUKE YOKOO et al
Title:
LIQUID MOLDING RESIN WITH NONSWELLING MICA
Assignment: 1
Reel/Frame:
027387/0850Recorded: 11/18/2011Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/02/2011
Exec Dt:
11/02/2011
Exec Dt:
11/04/2011
Exec Dt:
11/10/2011
Exec Dt:
11/10/2011
Exec Dt:
11/14/2011
Assignees:
3 GOI-MINAMI KAIGAN
CHIBA, JAPAN 290-8503
2727 MILLER CUT-OFF ROAD
LAPORTE, TEXAS 77571
Correspondent:
FITZPATRICK, CELLA, HARPER & SCINTO
1290 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10104-3800

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