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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13690374
Filing Dt:
11/30/2012
Publication #:
20130139380
Pub Dt:
06/06/2013
Inventors:
Kyoungran KIM, Byung Joon LEE, Sang Yun KIM, Seung Dae SEOK, Il-Young HAN, Dong-Gil SHIM et al
Title:
CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME
Assignment: 1
Reel/Frame:
029430/0852Recorded: 11/30/2012Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEE, BYUNG JOON
Exec Dt:
11/29/2012
KIM, KYOUNGRAN
Exec Dt:
11/29/2012
KIM, SANG YUN
Exec Dt:
11/29/2012
KIM, YOUNG BUM
Exec Dt:
11/29/2012
SEOK, SEUNG DAE
Exec Dt:
11/29/2012
SHIN, JAE-BONG
Exec Dt:
11/29/2012
HAN, IL-YOUNG
Exec Dt:
11/29/2012
KOH, MIN-GYU
Exec Dt:
11/29/2012
SHIM, DONG-GIL
Exec Dt:
11/29/2012
LEE, DONG-SOO
Exec Dt:
11/29/2012
JEON, SANG-JEAN
Exec Dt:
11/29/2012
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742
Correspondent:
JOHN A. CASTELLANO
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 8910
RESTON, VA 20195

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