Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/2020
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Application #:
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13312395
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Filing Dt:
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12/06/2011
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Publication #:
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Pub Dt:
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06/06/2013
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Inventors:
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Hsiu-Jen LIN, Chung-Shi LIU, Ming-Da CHENG, Chun-Cheng LIN, Yu-Peng TSAI, Cheng-Ting CHEN
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Title:
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METHOD OF PROCESSING SOLDER BUMP BY VACUUM ANNEALING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| LOWE HAUPTMAN HAM & BERNER, LLP (TSMC) |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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