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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8558229
Issue Dt:
10/15/2013
Application #:
13313747
Filing Dt:
12/07/2011
Publication #:
20130147032
Pub Dt:
06/13/2013
Inventors:
Wei-Cheng WU, Chen-Hua YU, Tzu-Wei CHIU, Shin-Puu JENG, Shang-Yun HOU, Tzuan-Horng LIU et al
Title:
PASSIVATION LAYER FOR PACKAGED CHIP
Assignment: 1
Reel/Frame:
027737/0599Recorded: 02/21/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JENG, SHIN-PUU
Exec Dt:
01/12/2012
WU, WEI-CHENG
Exec Dt:
12/30/2011
HOU, SHANG-YUN
Exec Dt:
01/09/2012
YU, CHEN-HUA
Exec Dt:
12/30/2011
LIU, TZUAN-HORNG
Exec Dt:
12/30/2011
CHIU, TZU-WEI
Exec Dt:
01/12/2012
HSU, KUO-CHING
Exec Dt:
12/30/2011
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA, VA 22314

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