Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13668306
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Filing Dt:
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11/04/2012
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Publication #:
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Pub Dt:
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06/20/2013
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Inventors:
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Hong-Jen Lai, Jenn-Dong Hwang, Hsu-Shen Chu, Tung-Han Chuang, Chao-Chi Jain, Che-Wei Lin
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Title:
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SOLID-LIQUID INTERDIFFUSION BONDING STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, |
| HSINCHU, TAIWAN 31040 |
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| NO.1, ROOSEVELT RD. SEC. 4, |
| TAIPEI, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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