Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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13343880
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Filing Dt:
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01/05/2012
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Publication #:
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Pub Dt:
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07/11/2013
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Inventors:
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Kenneth R. Rhyner, Peter Harper
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Title:
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Integrated Circuit Packaging With Ball Grid Array Having Differential Pitch To Enhance Thermal Performance
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P. O. BOX 655474 |
| MS 3999 |
| DALLAS, TEXAS 75265-5474 |
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| WADE JAMES BRADY III |
| P. O. BOX 655474 |
| MS 3999 |
| DALLAS, TX 75265-5474 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P. O. BOX 655474, M.S. 3999 |
| DALLAS, TEXAS 75265 |
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| STEVEN A. SHAW |
| TEXAS INSTRUMENTS INCORPORATED |
| P. O. BOX 655474, M.S. 3999 |
| DALLAS, TEXAS 75265 |
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