Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/13/2018
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Application #:
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13809893
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Filing Dt:
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03/28/2013
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Publication #:
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Pub Dt:
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07/18/2013
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Inventor:
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Ming-She Su
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Title:
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Composite Material, High-frequency Circuit Substrate Made Therefrom and Making Method Thereof
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5 INDUSTRY WEST ROAD, NORTHERN INDUSTRIAL PARK, SONGSHAN LAKE SCI.&TECH. INDUSTRY PARK, DONGGUAN CITY |
GUANGDONG, CHINA 523000 |
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CKC & PARTNERS CO., LTD. |
12TH FLOOR, RUTTONJEE HOUSE 11 DUDDELL |
STREET |
HONG KONG, HONG KONG |
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09/24/2024 01:47 PM
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