Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/19/2016
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Application #:
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13350363
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Filing Dt:
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01/13/2012
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Publication #:
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Pub Dt:
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07/18/2013
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Inventors:
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Wai Wah LEE, Jun Feng LI, Wei Boon WONG, Soo Kin Kenny TAN
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Title:
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METHOD OF RECOVERING A BONDING APPARATUS FROM A BONDING FAILURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| CPA GLOBAL |
| CASTLE STREET , LIBERATION HOUSE |
| ST HELIER, JERSEY, JE1 1BL JERSEY |
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