Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/16/2017
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Application #:
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13354272
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Filing Dt:
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01/19/2012
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Publication #:
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Pub Dt:
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07/25/2013
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Inventors:
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Seung-Hwan Kim, Kiran Misra, Louis Joseph Kerofsky, Christopher A. Segall
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Title:
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HIGH THROUGHPUT BINARIZATION (HTB) METHOD FOR CABAC IN HEVC
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5750 NW PACIFIC RIM BOULEVARD |
| CAMAS, WASHINGTON 98607 |
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| STOLOWITZ FORD COWGER LLP/SHARP |
| 621 SW MORRISON ST |
| SUITE 600 |
| PORTLAND, OR 97205 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22-22, NAGAIKE-CHO, ABENO-KU |
| OSAKA, JAPAN 545-8522 |
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| ROSIE VIRAY |
| 5750 NW PACIFIC RIM BLVD. |
| CAMAS, WA 98607 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING |
| BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, CHINA 518129 |
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| HUAWEI TECHNOLOGIES CO., LTD. |
| BUILDING G1-2, HUAWEI INDUSTRIAL BASE, |
| BANTIAN,LONGGANG DISTRICT |
| SHENZHEN, 518129 CHINA |
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