Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/16/2014
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Application #:
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13410195
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Filing Dt:
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03/01/2012
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Publication #:
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Pub Dt:
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09/05/2013
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Inventors:
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Hsien-Wei Chen, Shih-Wei Liang
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Title:
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ELECTRICAL CONNECTIONS FOR CHIP SCALE PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 027799 FRAME: 0288. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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