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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9082764
Issue Dt:
07/14/2015
Application #:
13780490
Filing Dt:
02/28/2013
Publication #:
20130228918
Pub Dt:
09/05/2013
Inventors:
Yi-An Chen, Yung-Jean Lu, Windsor Pipes Thomas III
Title:
THREE-DIMENSIONAL INTEGRATED CIRCUIT WHICH INCORPORATES A GLASS INTERPOSER AND METHOD FOR FABRICATING THE SAME
Assignment: 1
Reel/Frame:
029896/0286Recorded: 02/28/2013Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHEN, YI-AN
Exec Dt:
02/07/2013
LU, YUNG-JEAN
Exec Dt:
02/07/2013
THOMAS, WINDSOR PIPES
Exec Dt:
02/28/2013
Assignee:
CORNING INCORPORATED
SP-TI-03-1
CORNING, NEW YORK 14831
Correspondent:
CORNING INCORPORATED
SP-TI-3-1
CORNING, NY 14831
Assignment: 2
Reel/Frame:
032176/0325Recorded: 01/27/2014Pages: 9
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE INVENTOR THOMAS, WINDSOR PIPES PREVIOUSLY RECORDED ON REEL 029896 FRAME 0286. ASSIGNOR(S) HEREBY CONFIRMS THE INVENTOR THOMAS III, WINDSOR PIPES.
Assignors:
CHEN, YI-AN
Exec Dt:
02/07/2013
LU, YUNG-JEAN
Exec Dt:
02/07/2013
THOMAS, WINDSOR PIPES, III
Exec Dt:
02/28/2013
Assignee:
CORNING INCORPORATED
SP-TI-03-1
CORNING, NEW YORK 14831
Correspondent:
CORNING INCORPORATED
SP-TI-03-1
CORNING, NY 14831

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