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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13436124
Filing Dt:
03/30/2012
Publication #:
Pub Dt:
10/03/2013
Inventors:
Michael Su, Bryan Black, Joe Siegel, Neil McLellan, Michael Alfano
Title:
STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
Assignment: 1
Reel/Frame:
028235/0487Recorded: 05/18/2012Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/02/2012
Exec Dt:
05/02/2012
Exec Dt:
05/03/2012
Exec Dt:
05/02/2012
Assignee:
ONE AMD PLACE, PO BOX 3453
KEVIN A. O'NEIL
SUNNYVALE, CALIFORNIA 94088-3453
Correspondent:
TIMOTHY M. HONEYCUTT
16607 SAINT JOHNS WOOD DR.
TOMBALL, TX 77377
Assignment: 2
Reel/Frame:
028235/0510Recorded: 05/18/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/15/2012
Assignee:
ONE AMD PLACE, PO BOX 3453
KEVIN A. O'NEIL
SUNNYVALE, CALIFORNIA 94088-3453
Correspondent:
TIMOTHY M. HONEYCUTT
16607 SAINT JOHNS WOOD DR.
TOMBALL, TX 77377

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