Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13441627
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Filing Dt:
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04/06/2012
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Publication #:
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Pub Dt:
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10/10/2013
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Inventors:
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Hsin-Chih Tai, Tiejun Dai, Hongli Yang, Yin Qian, Duli Mao, Howard E. Rhodes
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Title:
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METHOD AND APPARATUS PROVIDING INTEGRATED CIRCUIT SYSTEM WITH INTERCONNECTED STACKED DEVICE WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4275 BURTON DRIVE |
| SANTA CLARA, CALIFORNIA 95054 |
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| BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085-4040 |
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