Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/25/2016
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Application #:
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13976098
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Filing Dt:
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06/26/2013
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Publication #:
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Pub Dt:
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10/17/2013
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PCT #:
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US2011065512
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Inventors:
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Debendra Mallik, Sridhar Narasimhan, Mathew J. Manusharow, Thomas A. Boyd
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Title:
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PACKAGE FOR A MICROELECTRONIC DIE, MICROELECTRONIC ASSEMBLY CONTAINING SAME, MICROELECTRONIC SYSTEM, AND METHOD OF REDUCING DIE STRESS IN A MICROELECTRONIC PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
RNB-4-150 |
SANTA CLARA, CALIFORNIA 95052 |
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MAKI CHO |
1279 OAKMEAD PARKWAY |
SUNNYVALE, CA 94085 |
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