Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/11/2014
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Application #:
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13757857
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Filing Dt:
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02/04/2013
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Publication #:
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Pub Dt:
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10/31/2013
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Inventor:
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MING-JAAN HO
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Title:
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RESIN COATED COPPER FOIL, METHOD FOR MANUFACTURING SAME AND MULTI-LAYER CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE |
| TAYUAN, TAOYUAN, TAIWAN |
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| CLIFFORD O. CHI |
| 1203 W. IMPERIAL HWY SUITE 100 |
| BREA, CA 92821 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4F., NO.156,SEC 1,ZHONGSHAN RD.,BANQIAO DIST.,,NEW TAIPEI CITY 22065,TAIWAN(R.O.C) |
| NEW TAIPEI, TAIWAN |
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| ZHIGANG MA |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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