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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/20/2015
Application #:
13891126
Filing Dt:
05/09/2013
Publication #:
Pub Dt:
11/07/2013
Inventors:
Jeffrey F. DeNatale, Philip A. Stupar, Yu-Hua Lin, Robert L. Borwick III et al
Title:
MICRO-SCALE SYSTEM TO PROVIDE THERMAL ISOLATION AND ELECTRICAL COMMUNICATION BETWEEN SUBSTRATES
Assignment: 1
Reel/Frame:
030830/0498Recorded: 07/18/2013Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/03/2011
Exec Dt:
05/06/2011
Exec Dt:
05/06/2011
Exec Dt:
05/09/2011
Exec Dt:
05/06/2011
Assignee:
1049 CAMINO DOS RIOS
THOUSAND OAKS, CALIFORNIA 91360-2362
Correspondent:
BROOKS ACORDIA IP LAW, P.C.
1445 E. LOS ANGELES AVE.
SUITE 108
SIMI VALLEY, CA 93065

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