Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/05/2016
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Application #:
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13461859
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Filing Dt:
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05/02/2012
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Publication #:
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Pub Dt:
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11/07/2013
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Inventors:
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Irmgard Escher-Poeppel, Edward Fuergut
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Title:
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METHODS FOR MANUFACTURING A CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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AM CAMPEON 1 - 12 |
NEUBIBERG, GERMANY 85579 |
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VIERING, JENTSCHURA & PARTNER |
3770 HIGHLAND AVE. |
SUITE 203 |
MANHATTAN BEACH, CA 90266 |
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