Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/18/2015
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Application #:
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13474239
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Filing Dt:
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05/17/2012
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Publication #:
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Pub Dt:
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11/21/2013
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Inventors:
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Gary D. Carpenter, Alan J. Drake, Rachel Gordin, Michael J. Shapiro, Edmund J. Sprogis
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Title:
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Stacked Through-Silicon Via (TSV) Transformer Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| STEPHEN J. WALDER, JR. |
| WALDER INTELLECTUAL PROPERTY LAW, P.C. |
| 17330 PRESTON ROAD, SUITE 100B |
| DALLAS, TX 75252 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT, REEL #028232/FRAME #0704, CORRECTING FIRST INVENTOR'S NAME TO GARY D. CARPENTER
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| STEPHEN J. WALDER, JR. |
| WALDER INTELLECTUAL PROPERTY LAW. P.C. |
| 17330 PRESTON ROAD, SUITE 100B |
| DALLAS, TX 75252 |
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