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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/10/2016
Application #:
13900081
Filing Dt:
05/22/2013
Publication #:
Pub Dt:
12/05/2013
Inventors:
Yu-Ting HUANG, Shu-Ming CHANG, Yen-Shih HO, Tsang-Yu LIU
Title:
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Assignment: 1
Reel/Frame:
030468/0201Recorded: 05/22/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/13/2013
Exec Dt:
05/13/2013
Exec Dt:
05/13/2013
Exec Dt:
05/13/2013
Assignee:
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK
JHONGLI CITY, TAOYUAN COUNTY, TAIWAN 32062
Correspondent:
WEN LIU
350 S. FIGUEROA STREET, SUITE 975
LOS ANGELES, CA 90071

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