Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13597239
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Filing Dt:
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08/28/2012
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Publication #:
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Pub Dt:
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12/05/2013
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Inventors:
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NIEN-TIEN CHENG, MING-HSIU CHUNG
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Title:
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INJECTION MOLDING APPARATUS HAVING A THERMOSTAT ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| (236)NO. 3-2, CHUNG SHAN RD. |
| TU-CHENG, NEW TAIPEI, TAIWAN |
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| ZHIGANG MA |
| 1203 W. IMPERIAL HWY SUITE 100 |
| BREA, CA 92821 |
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