Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
01/05/2016
|
Application #:
|
13784419
|
Filing Dt:
|
03/04/2013
|
Publication #:
|
|
Pub Dt:
|
12/12/2013
| | | | |
Inventor:
|
Michael A. Tischler
|
Title:
|
WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
UNIT 1A -2751 NORTH FRASER WAY |
BURNABY, BRITISH COLUMBIA, CANADA V5J 5G4 |
|
|
|
BINGHAM MCCUTCHEN LLP |
2020 K STREET NW |
WASHINGTON, DC 20006 |
|
|
Assignment:
2
|
|
|
|
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
200 BAY STREET, SOUTH TOWER, ROYAL BANK PLAZA |
SUITE 2210 |
TORONTO, CANADA M5J 2J2 |
|
|
|
JENNIFER FITZPATRICK |
C/O COOLEY LLP |
4401 EASTGATE MALL |
SAN DIEGO, CA 92121 |
|
|
Search Results as of:
09/24/2024 01:38 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|