Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13864278
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Filing Dt:
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04/17/2013
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Publication #:
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Pub Dt:
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12/26/2013
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Inventors:
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CHE-WEI HSU, SHIH-PING HSU
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Title:
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PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE |
| TAYUAN, TAOYUAN, TAIWAN |
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| ZHIGANG MA |
| 1203 W. IMPERIAL HWY SUITE 100 |
| BREA, CA 92821 |
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