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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/05/2017
Application #:
13994339
Filing Dt:
07/18/2013
Publication #:
Pub Dt:
01/09/2014
Inventors:
Dae-Yoon Chi, Byoung-Se Lee, Jae-Hak Lee, So-Young Chu, Woon-Jung Jung, Hye-Rim Kwon
Title:
PRECURSOR COMPOUND CONNECTED TO SOLID SUPPORT FOR MANUFACTURING 18F RADIOPHARMACEUTICAL, METHOD FOR MANUFACTURING SAME, AND APPLICATION THEREOF
Assignment: 1
Reel/Frame:
030779/0702Recorded: 07/11/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/04/2013
Exec Dt:
06/07/2013
Exec Dt:
06/07/2013
Exec Dt:
06/07/2013
Exec Dt:
06/07/2013
Exec Dt:
06/03/2013
Assignee:
SOGANG UNIVERSITY
1 SINSU-DONG, MAPO-GU
SEOUL, KOREA, REPUBLIC OF 121-742
Correspondent:
DON W. BULSON
1621 EUCLID AVENUE
19TH FLOOR
CLEVELAND, OH 44115
Assignment: 2
Reel/Frame:
032342/0097Recorded: 03/04/2014Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/13/2014
Assignee:
6TH FLOOR, ASAN EDUCATION RESEARCH BLDG.
OLYMPIC-RO 43-GIL 88, SONGPA-GU
SEOUL, KOREA, REPUBLIC OF 138-736
Correspondent:
DON W. BULSON
1621 EUCLID AVENUE
19TH FLOOR
CLEVELAND, OH 44115

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