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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/21/2014
Application #:
13553725
Filing Dt:
07/19/2012
Publication #:
Pub Dt:
01/23/2014
Inventor:
Tsai-Yu Huang
Title:
THREE-DIMENSIONAL INTEGRATED CIRCUITS AND FABRICATION THEREOF
Assignment: 1
Reel/Frame:
028629/0699Recorded: 07/20/2012Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/12/2012
Assignee:
HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD., KUEISHAN
TAOYUAN, TAIWAN 333
Correspondent:
QUINTERO LAW OFFICE, PC
615 HAMPTON DRIVE, SUITE A202
VENICE, CA 90291

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