Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/11/2014
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Application #:
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13551656
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Filing Dt:
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07/18/2012
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Publication #:
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Pub Dt:
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01/23/2014
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Inventors:
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Joachim Mahler, Edward Fuergut, Khalil Hosseini, Georg Meyer-Berg
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Title:
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EMBEDDED INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MANUFACTURING AN EMBEDDED INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| VIERING, JENTSCHURA & PARTNER |
| 3770 HIGHLAND AVE. |
| SUITE 203 |
| MANHATTAN BEACH, CA 90266 |
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