Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/11/2014
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Application #:
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13564922
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Filing Dt:
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08/02/2012
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Publication #:
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Pub Dt:
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02/06/2014
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Inventors:
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Ottmar Geitner, Walter Hartner, Maciej Wojnowski, Ulrich Wachter, Michael Bauer et al
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Title:
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CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| VIERING, JENTSCHURA & PARTNER |
| 3770 HIGHLAND AVE. |
| SUITE 203 |
| MANHATTAN BEACH, CA 90266 |
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