Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13955259
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Filing Dt:
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07/31/2013
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Publication #:
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Pub Dt:
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02/06/2014
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Inventors:
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Tae Hong MIN, Taeje CHO, Ji Hwang KIM, Chajea JO, Young Kun JEE, Yun Seok CHOI
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Title:
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SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, JAPAN 443-742 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
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