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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13845093
Filing Dt:
03/18/2013
Publication #:
Pub Dt:
02/13/2014
Inventors:
Chang Bo Lee, Chang Sup Ryu, Young Gwan Ko, Cheol Ho Choi
Title:
FLAT DAM AND METHOD FOR MANUFACTURING CHIP PACKAGE USING THE SAME
Assignment: 1
Reel/Frame:
030150/0956Recorded: 04/04/2013Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/05/2013
Exec Dt:
02/05/2013
Exec Dt:
02/05/2013
Exec Dt:
02/05/2013
Assignee:
314, MAETAN 3-DONG, YEONGTONG-GU,, SUWON,
GYUNGGI-DO, KOREA, REPUBLIC OF 443-743
Correspondent:
LASAS & PARRY LLP
5670 WILSHIRE BLVD
LOS ANGELES, CA 90036

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