Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13845093
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Filing Dt:
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03/18/2013
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Publication #:
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Pub Dt:
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02/13/2014
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Inventors:
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Chang Bo Lee, Chang Sup Ryu, Young Gwan Ko, Cheol Ho Choi
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Title:
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FLAT DAM AND METHOD FOR MANUFACTURING CHIP PACKAGE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN 3-DONG, YEONGTONG-GU,, SUWON, |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| LASAS & PARRY LLP |
| 5670 WILSHIRE BLVD |
| LOS ANGELES, CA 90036 |
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