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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	9040838	Issue Dt:	05/26/2015	Application #:	14011159	Filing Dt:	08/27/2013
Publication #:	20140054073	Pub Dt:	02/27/2014
Inventors:	Chang Bo LEE, Chang Sup RYU, Hyo Bin PARK, Cheol Ho CHOI
Title:	METHOD FOR FORMING SOLDER RESIST AND SUBSTRATE FOR PACKAGE

Assignment: 1

Reel/Frame:

035470/0774

Recorded: 04/22/2015

Pages: 3

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

LEE, CHANG BO

Exec Dt:

04/22/2015

RYU, CHANG SUP

Exec Dt:

04/22/2015

PARK, HYO BIN

Exec Dt:

04/22/2015

CHOI, CHEOL HO

Exec Dt:

04/22/2015

Assignee:

SAMSUNG ELECI'RO-MECHANICS CO., LTD.

MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU,

SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-743

Correspondent:

STAAS AND HALSEY LLP

1201 NEW YORK AVENUE, N.W.

SUITE 700

WASHINGTON, DC 20005

Assignment: 2

Reel/Frame:

035508/0148

Recorded: 04/27/2015

Pages: 6

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 035470 FRAME 0774. ASSIGNOR(S) HEREBY CONFIRMS THE SAMSUNG ELECTRO-MECHANICS CO., LTD..

Assignors:

LEE, CHANG BO

Exec Dt:

04/22/2015