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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
13594498
Filing Dt:
08/24/2012
Publication #:
Pub Dt:
02/27/2014
Inventors:
Anandan Ramasamy, Yonggang Jin, Yun Liu, Eric Saugier, Romain Coffy, How Yuan Hwang
Title:
METHOD FOR MAKING A DOUBLE-SIDED FANOUT SEMICONDUCTOR PACKAGE WITH EMBEDDED SURFACE MOUNT DEVICES, AND PRODUCT MADE
Assignment: 1
Reel/Frame:
028911/0422Recorded: 09/06/2012Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/03/2012
Exec Dt:
08/03/2012
Exec Dt:
08/03/2012
Exec Dt:
08/02/2012
Exec Dt:
08/02/2012
Exec Dt:
08/15/2012
Assignees:
12 RUE JULES HOROWITZ
GRENOBLE, FRANCE 38000
28 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569508
Correspondent:
DAVID V. CARLSON
701 5TH AVENUE, SUITE 5400
SEATTLE, WA 98104
Assignment: 2
Reel/Frame:
030311/0585Recorded: 04/29/2013Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/03/2012
Exec Dt:
08/03/2012
Exec Dt:
08/03/2012
Exec Dt:
08/02/2012
Exec Dt:
08/02/2012
Exec Dt:
08/15/2012
Assignees:
12 RUE JULES HOROWITZ
GRENOBLE, FRANCE 38000
28 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569508
Correspondent:
DAVID V. CARLSON
701 FIFTH AVENUE, SUITE 5400
SEATTLE, WA 98104

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