Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/28/2014
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Application #:
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13598352
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Filing Dt:
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08/29/2012
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Publication #:
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Pub Dt:
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03/06/2014
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Inventor:
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Chuan Hu
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Title:
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SEMICONDUCTOR DEVICE WITH PRE-MOLDING CHIP BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95054 |
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LISA M. LEE |
1241 CONCOURSE DR. |
RAPID CITY, SD 57703 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, IRELAND D15 YH6H |
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TAHOE RESEARCH, LTD. |
BLANCHARDSTOWN CORPORATE PARK 2 |
PLAZA 255, SUITE 2A |
DUBLIN, D15 YH6H IRELAND |
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