Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/03/2014
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Application #:
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13714923
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Filing Dt:
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12/14/2012
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Publication #:
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Pub Dt:
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03/06/2014
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Inventors:
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HSIU-CHUAN SHIH, CHENG-WEN WU
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Title:
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DOUBLE THROUGH SILICON VIA STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 101, SECTION 2, KUANG-FU ROAD, |
| HSINCHU, TAIWAN 30013 |
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| MUNCY, GEISSLER, OLDS & LOWE, PLLC |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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