Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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03/22/2016
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Application #:
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13834181
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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03/13/2014
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Inventor:
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Sunghyok KIM
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 90, SUDO-RO, WONMI-GU, BUCHEON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 420-712 |
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| SHERR & JIANG, PLLC |
| 620 HERNDON PARKWAY |
| SUITE 320 |
| HERNDON, VA 20170 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 432 TAEHERAN-RO |
| DAECHI-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| DANIEL BRUZZONE |
| 4800 IDS CENTER |
| 80 S. 8TH STREET |
| MINNEAPOLIS, MN 55402 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 303 TERRY FOX DRIVE |
| SUITE 300 |
| OTTAWA, CANADA K2K 3J1 |
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| COLUMBA TECHNOLOGIES INC. |
| 1891 ROBERTSON ROAD |
| SUITE 100 |
| OTTAWA, K2H 5B7 CANADA |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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