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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
14077517
Filing Dt:
11/12/2013
Publication #:
Pub Dt:
03/13/2014
Inventors:
Cheng Cen, Steven B. Herschbein, Narender Rana, Nedal R. Saleh, Alok Vaid
Title:
IN-SITU ACTIVE WAFER CHARGE SCREENING BY CONFORMAL GROUNDING
Assignment: 1
Reel/Frame:
031590/0064Recorded: 11/13/2013Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/10/2013
Exec Dt:
11/12/2013
Exec Dt:
11/08/2013
Exec Dt:
11/07/2013
Exec Dt:
11/11/2013
Assignees:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
840 N. MCCARTHY BOULEVARD
MILPITAS, CALIFORNIA 95035
Correspondent:
HOFFMAN WARNICK LLC
540 BROADWAY
4TH FLOOR
ALBANY, NY 12207
Assignment: 2
Reel/Frame:
056987/0001Recorded: 05/12/2021Pages: 1045
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/17/2020
Assignee:
440 STONE BREAK ROAD EXTENSION
MALTA, NEW YORK 12020
Correspondent:
BENJAMIN PETERSEN
1460 EL CAMINO REAL, 2ND FLOOR
SHEARMAN & STERLING LLP
MENLO PARK, CA 94025

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