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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13920637
Filing Dt:
06/18/2013
Publication #:
Pub Dt:
03/27/2014
Inventors:
Runchen Fang, Qingqing Sun, Shan Zheng, Pengfei Wang, Wei Zhang, Peng Zhou
Title:
COMPOUND DIELECTRIC ANTI-COPPER-DIFFUSION BARRIER LAYER FOR COPPER CONNECTION AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
030639/0982Recorded: 06/19/2013Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/06/2013
Exec Dt:
06/06/2013
Exec Dt:
06/06/2013
Exec Dt:
06/06/2013
Exec Dt:
06/06/2013
Exec Dt:
06/06/2013
Assignee:
NO. 220 HANDAN ROAD
SHANGHAI, CHINA 200433
Correspondent:
JEFFREY L. WILSON
3100 TOWER BOULEVARD
SUITE 1200
DURHAM, NC 27707

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