Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13920637
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Filing Dt:
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06/18/2013
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Publication #:
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Pub Dt:
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03/27/2014
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Inventors:
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Runchen Fang, Qingqing Sun, Shan Zheng, Pengfei Wang, Wei Zhang, Peng Zhou
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Title:
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COMPOUND DIELECTRIC ANTI-COPPER-DIFFUSION BARRIER LAYER FOR COPPER CONNECTION AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 220 HANDAN ROAD |
| SHANGHAI, CHINA 200433 |
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| JEFFREY L. WILSON |
| 3100 TOWER BOULEVARD |
| SUITE 1200 |
| DURHAM, NC 27707 |
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