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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/10/2015
Application #:
14099425
Filing Dt:
12/06/2013
Publication #:
Pub Dt:
04/03/2014
Inventors:
Masahiko HATA, Osamu Ichikawa, Yuji Urabe, Noriyuki Miyata, Tatsuro Maeda, Tetsuji Yasuda
Title:
METHOD OF PRODUCING SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFER
Assignment: 1
Reel/Frame:
031759/0428Recorded: 12/11/2013Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/14/2013
Exec Dt:
11/19/2013
Exec Dt:
11/14/2013
Exec Dt:
11/12/2013
Exec Dt:
11/12/2013
Exec Dt:
11/12/2013
Assignees:
27-1, SHINKAWA 2-CHOME
CHUO-KU, TOKYO, JAPAN 1048260
3-1, KASUMIGASEKI 1-CHOME
CHIYODA-KU, TOKYO, JAPAN 1008921
Correspondent:
SUGHRUE MION PLLC
2100 PENNSYLVANIA AVENUE, NW
WASHINGTON, DC 20037-3213

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