Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2015
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Application #:
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14143663
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Filing Dt:
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12/30/2013
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Publication #:
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Pub Dt:
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04/24/2014
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Inventors:
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Xiaolu Song, Lixian Wang, Ninghua Zhu
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Title:
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Optoelectronic device packaging method and chip assembly having an isolation dielectric located on both sides of a high-frequency transmission line to form a coplanar waveguide transmission line (As amended)
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HUAWEI ADMINISTRATION BUILDING |
BANTIAN, LONGGANG DISTRICT, GUANGDONG |
SHENZHEN, CHINA 518129 |
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GUSTAVO SILLER, JR. |
BRINKS GILSON & LIONE |
PO BOX 10395 |
CHICAGO, IL 60610 |
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