Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/13/2018
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Application #:
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13658895
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Filing Dt:
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10/24/2012
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Publication #:
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Pub Dt:
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04/24/2014
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Inventors:
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Yu-Jen TSENG, Yen-Liang LIN, Tin-Hao KUO, Chen-Shien CHEN, Mirng-Ji LII
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Title:
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BUMP-ON-TRACE INTERCONNECTION STRUCTURE FOR FLIP-CHIP PACKAGES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| DUANE MORRIS LLP (TSMC) IP DEPARTMENT |
| 30 SOUTH 17TH STREET |
| PHILADELPHIA, PA 19103-4196 |
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