Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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13667060
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Filing Dt:
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11/02/2012
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Publication #:
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Pub Dt:
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05/08/2014
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Inventors:
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Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng et al
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Title:
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MOLDED UNDERFILLING FOR PACKAGE ON PACKAGE DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 R.O.C. |
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SLATER & MATSIL, L.L.P. |
17950 PRESTON ROAD |
SUITE 1000 |
DALLAS, TX 75252 |
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